AI & Data Center Cooling

Data center facility managers and thermal engineers prioritize fluid stability and material compatibility above all else when sourcing liquid cooling solutions. With the rise of AI workloads driving rack densities beyond 50kW, the thermal transfer efficiency of the fluid directly impacts Power Usage Effectiveness (PUE). Buyers require Certificate of Analysis (COA) documentation that verifies specific inhibitor packages designed for mixed-metal loops, particularly those containing both copper cold plates and aluminum manifolds. For Direct-to-Chip (DTC) applications, strict filtration specifications and low electrical conductivity metrics are essential to mitigate risks associated with potential leaks near sensitive components. Procurement teams also evaluate the freeze point depression relative to the facility’s geographic location to prevent burst pipes during free cooling cycles. Furthermore, auditors frequently request documentation proving the fluid constitutes a consistent formulation to ensure long-term chemical compatibility with seals, hoses, and quick disconnects found in Coolant Distribution Units (CDUs).